Imagination is attending the TSMC 2019 Technology Symposium in Santa Clara, which runs today and tomorrow, the 23rd and 24th of April. The semiconductor-focused event takes place ten times a year around the world, with three locations in the US, in China, Taiwan, Israel and the Netherlands. At the show attendees get the latest information of cutting-edge process technologies and semiconductor packaging, in particular with regard to solution for mobile, automotive and the IoT.
The Imagination team will be located at Booth 220 at the Santa Clara Convention Center where you can talk to us about our leading IP solutions for SoCs for graphics, AI and connectivity.
On the graphics front, we have demos that show off some of the leading-edge graphics capabilities of our PowerVR architecture, such as PVRIC4, our unique image compression technology, and our demos showing our ability to run the efficient Vulkan API even on small embedded GPUs.
Imagination has a great presence in the automotive space and that reflected by our car cluster demo, which shows off how a digital dashboard car cluster, containing a surround view model and infotainment can be run smoothly an efficiently on our GPUs.
As well as graphics PowerVR is also strong in AI, and our object detection demo shows off the capabilities of our PowerVR Series3NX neural network accelerator NNA
Last, but not least, we also have our lives demos of our Ensigma Bluetooth technology, showing off Bluetooth Low Energy 5.0/15.4 IP running on Global Foundries 22FDX silicon, which brings a specific advantage. For the smart-home market, the requirement is to be able to run stably at up to 105 degrees, but our silicon-proven IP is able to run far in excess of that.
If you’re at the show do come by our booth for a chat so we can discuss how our solutions can help you create the perfect SoC for your customers.