iEB100 Series

Ensigma Bluetooth Connectivity Family

Low power, small form factor Bluetooth and 15.4 combo

The iEB100 series consist of Bluetooth Low Energy v5.1 and a  Bluetooth Low Energy v5.1 plus IEEE 802.15.4 combination IP. They enable compact ultra-small form factor solutions with minimal external components to reduce the costs for large-scale production. Utilizing advanced design techniques and process technology, we are capable of delivering the lowest active and idle power. The iEB100 series extends the system battery life while maintaining consistent connectivity and provides a rich set of features.


Bluetooth Low Energy v5.1+ IEEE802.15.4 

 
Features
  • Designed for Global Foundries 22 nm FDX CMOS
  • RF Core area 1.75mm²
  • Typical power consumption 6mW
  • Wide range of reference crystal frequencies supported (16- 40MHz)
  • 32.768 kHz oscillator supported for low power operation
  • Designed for QFN packages
Benefits
  • Complete BLE solution
  • Low power
  • Easy integration into a SOC
  • RF Delivered as GDSII with baseband and link layer provided as soft IP
Applications
  • Internet of Things
  • Connected consumer products
  • Industrial automation
Configurations
  • BLE/802.15.4 combo
    Supports Bluetooth 5.1 (1Mbps and 2Mbps) Modes and IEEE 802.15.4 2450 MHz DSSS PHY employing O-QPSK modulation
RF Features
  • BLE Sensitivity:
    • 125 Kbps: -103 dBm
    • 500 Kbps: -99 dBm
    • 1 Mbps: -97 dBm
    • 2 Mbps: -93 dBm
  • 15.4 Sensitivity:
    • -105 dBm
  • TX Output Power up to +5dBm
  • Integrated transmit/receive switch for RF
  • Single pin RF antenna interface
Power Management
  • On-chip LDO regulation SOC
Frequency Reference Options
  • External (16 MHz – 40 MHz) Reference XO support
Software
  • Controller stack (firmware)
Control Interface Options
  • AXI host interface to an MCU on the same SoC
Process
  • GF 22nm FDSOI
Package
  • Support for QFN packages – no requirement for external matching
  • Other packages are supported but may require custom external matching
Bluetooth Low Energy v5.1
Features
  • Designed for GF 22FDX CMOS process
  • Supports Bluetooth Low Energy v5.1
  • Self-contained sleep control
  • Typical power consumption 6mW
  • Wide range of reference crystal frequencies
    supported (16- 40MHz)
  • 32.768 kHz oscillator supported for low power
    operation
General features
  • Complies with
    • Bluetooth V5.1, all mandatory and key features
    • ETSI EN 300 328 and EN 300 440 Class 2 (Europe)
    • ARIB STD-T66 (Japan)
  • Multiple simultaneous BLE connections
  • No external trimming required in production except for XO
    frequency trimming
  • Wi-Fi coexistence through PTA (Packet Traffic Arbiter)
    interface
  • 2.11 mm² die area, including analogue pads for GF22FDX
  • Low gate count/memory for the link layer/baseband
Power Management
  • Power Management System Comprising
    • LDO regulators
    • Always On (AON) block
    • Firmware managed sleep Controller, supporting external 32 KHz clock
  • Multiple Power Domains
  • On-chip LDO regulation SOC
Benefits
  • Complete Bluetooth Low Energy support up to HCI
  • Low power consumption
  • Easy integration into a SoC
RF features
  • Complete 2.4 GHz RF including PA, LNA
  • BLE Sensitivity:
    • 125 Kbps: -103 dBm
    • 500 Kbps: -99 dBm
    • 1 Mbps: -97 dBm
    • 2 Mbps: -93 dBm
  • Customised power amplifier to minimise Tx power consumption
    • Tx Output Power up to +5dBm
  • Power efficient AGC
  • Optimised PLL power consumption
  • Internal LDO regulators
  • Power optimised DAC/ADC design
  • Integrated Tx/Rx switch for RF
Software
  • Controller stack (firmware)
  • Firmware can be placed in ROM for low-power operation
  • Software patch support for futures feature enhancement