Wi-Fi, Bluetooth and IEEE 802.15.4 connectivity
High-performance and low-power connectivity solutions for all markets
Ensigma provides a range of high performance and low-power connectivity solutions for Wi-Fi, Bluetooth and IEEE 802.15.4.
Ensigma high performance Wi-Fi focuses on delivering the best power/performance Wi-Fi, complete with a rich set of features. Using the highly flexible Ensigma hardware radio platform, the solution can be configured to enable multiple configurations from a single platform. For mobile compute and infrastructure hardware, our high performance Wi-Fi is designed to work across all markets to provide the most efficient performance without compromising throughput.
Ensigma low-power connectivity focuses on delivering industry leading power consumption without compromising performance. For IoT, wearables and battery powered devices, our wide range of solutions are designed to work across all markets to provide the most efficient power and performance. Utilising advanced design techniques and process technology to deliver the lowest active and idle power, the Ensigma low-power IP solution extends the system battery life while maintaining consistent connectivity and complimented by a rich set of features.
Solutions designed for easy integration
The Ensigma high performance and low-power connectivity solutions are complete ready to market IP packages including integrated RF, AFE, baseband PHY and MAC. The IP is supplied as a pre laid-out solution, with pre regulatory and interoperability testing, enabling the fastest time to market and reduced development costs. Ensigma low-power connectivity solutions enable compact ultra-small form factors with minimal external components, reducing silicon costs and system level eBOM costs.
Delivering connectivity for all devices
Ensigma’s range of Wi-Fi, Bluetooth, BLE and IEEE 802.15.4 connectivity solutions are designed for all markets – from low data rate, low-power solutions for consumers and IoT, through to high-performance solutions for demanding networking and computing applications.
Ensigma IP solutions for RF communications are well suited to address the requirements of next generation wired and wireless connectivity including single-solution support for the majority of current and planned future standards.
Ensigma’s range of Bluetooth LE and Wi-Fi connectivity IP provides proven solutions to the complex communication and power consumption challenges presented by wearables.
Ensigma connectivity provides a comprehensive range of broadcast and connectivity standards, combined with the best-in-class radio channel performance, enabling digital radio and in-car wireless networks.
Internet of Things
The Internet of Things (IoT) is set not just to revolutionise the important embedded systems market, but the very nature of the way we interact with devices. Ensigma RPUs allow efficient integration of connectivity across all classes of IoT devices.
Ensigma connectivity solutions
Ensigma Connectivity is a family of high-performance and low power wireless IP cores for wireless connectivity standards such as Wi-Fi, Bluetooth Low Energy (BLE) and IEEE 802.15.4 based solutions such as Zigbee and Thread. The IP is specifically designed to meet the communications requirements for the low-power consumption markets such as the Internet of Things (IoT) and wearable’s, Ensigma Connectivity solutions implement all of the requirements of tomorrow’s complex low-power SoCs.
The high performance Wi-Fi baseband IP provides a highly flexible, dual-band Wi-Fi solution that is capable of supporting up to IEEE 802.11ac 2×2 MIMO and provides a complete physical and MAC layer.
GF 22FDX Wi-Fi
Low Power Wi-Fi solution is a complete ready to market IP package including RF, AFE, baseband PHY and MAC. The IP can be provided in ‘black box’ or ‘white box’ configurations.
TSMC 40LP Wi-Fi
The Ensigma low-power Wi-Fi consists of end-to-end solution including RF, AFE, baseband PHY and MAC. The RF IP is offered in the 40nm TSMC CMOS process.
GF 22FDX BLE/802.15.4
The BLE/802.15.4 system enables compact ultra-small form factor solutions with minimal external components to reduce the costs for large-scale production.