CRF4510 RFIC IP in TSMC 65nm LP

Ensigma RF Connectivity

Ultra-efficient, high performance connectivity

The Ensigma high-performance CRF45xx and CRF46xx Wi-Fi RFIC IPs in TSMC 65nm LP provide a highly flexible, dual-band Wi-Fi solution capable of supporting up to IEEE 802.11n/ac 4×4 MIMO, IEEE 802.11p and Bluetooth 5.0. The IPs provide a compact ultra-small form factor solution with minimal external components to drive the costs for mass volumes and allows for flexibility in size, form, and function.

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Features
  • Designed for TSMC 65nm LP process
  • Internal power amplifiers
  • Analog IQ-interface
  • Designed for QFN packages
Benefits
  • Complete low-power Wi-Fi solution
  • Silicon ready design
  • Low power consumption
  • Easy integration with baseband SoCs
Applications
General Features
  • 3/4-wire SPI control interface
  • On-chip LDO regulators
  • On-chip XO for XTAL operation
  • Direct conversion receiver and transmitter
  • RX RSSI function
  • TX TSSI function
  • On-chip baluns for single-ended RF input and output
  • No external trimming required in production except for XO frequency trimming
  • Low output spur and strong receive blocking performance
  • Support for power compensation of external PA to produce stable transmit power across temperature
  • Fast AGC and wide dynamic range allow for excellent robustness against fading
  • Fully integrated fractional-N synthesizer
  • Low phase noise and fast switching time
  • Bluetooth 5.0 transceiver
Process
  • TSMC 65nm LP (1P6M, 1.2V/2.5V)
  • 6 metal layers including UTM (ultra-thick metal)
Key Characteristics
  • Integrated power amplifiers
    • 16 dBm maximum output power in 5 GHz
    • 18 dBm maximum output power in 2.4 GHz
  • Support for digital pre-distortion
  • 22 dB gain range in transmit mode
  • TX EVM < -35 dB for external power amplifier
  • TX EVM < -32 dB with internal power amplifier
  • Supported reference clock frequencies: 40 and 52 MHz
  • Support for 20 MHz, 40 MHz and 80 MHz channels
  • Fast wake up from standby, typically 20 µs
  • Die area: 9.0 mm2
  • Die dimensions: 1856 um x 4864 um
Package
  • Rt-MLF with 96 pins
  • Support for QFN packages