CRF4510 RFIC IP in TSMC 65nm LP
Ensigma RF Connectivity
Ultra-efficient, high performance connectivity
The Ensigma high-performance CRF45xx and CRF46xx Wi-Fi RFIC IPs in TSMC 65nm LP provide a highly flexible, dual-band Wi-Fi solution capable of supporting up to IEEE 802.11n/ac 4×4 MIMO, IEEE 802.11p and Bluetooth 5.0. The IPs provide a compact ultra-small form factor solution with minimal external components to drive the costs for mass volumes and allows for flexibility in size, form, and function.
Features
- Designed for TSMC 65nm LP process
- Internal power amplifiers
- Analog IQ-interface
- Designed for QFN packages
Benefits
- Complete low-power Wi-Fi solution
- Silicon ready design
- Low power consumption
- Easy integration with baseband SoCs
Applications
- Digital TV and set-top boxes
- Tablets
- Connected consumer products
- Internet of Things
- Intelligent Transportation Systems
General Features
- 3/4-wire SPI control interface
- On-chip LDO regulators
- On-chip XO for XTAL operation
- Direct conversion receiver and transmitter
- RX RSSI function
- TX TSSI function
- On-chip baluns for single-ended RF input and output
- No external trimming required in production except for XO frequency trimming
- Low output spur and strong receive blocking performance
- Support for power compensation of external PA to produce stable transmit power across temperature
- Fast AGC and wide dynamic range allow for excellent robustness against fading
- Fully integrated fractional-N synthesizer
- Low phase noise and fast switching time
- Bluetooth 5.0 transceiver
Process
- TSMC 65nm LP (1P6M, 1.2V/2.5V)
- 6 metal layers including UTM (ultra-thick metal)
Key Characteristics
- Integrated power amplifiers
- 16 dBm maximum output power in 5 GHz
- 18 dBm maximum output power in 2.4 GHz
- Support for digital pre-distortion
- 22 dB gain range in transmit mode
- TX EVM < -35 dB for external power amplifier
- TX EVM < -32 dB with internal power amplifier
- Supported reference clock frequencies: 40 and 52 MHz
- Support for 20 MHz, 40 MHz and 80 MHz channels
- Fast wake up from standby, typically 20 µs
- Die area: 9.0 mm2
- Die dimensions: 1856 um x 4864 um
Package
- Rt-MLF with 96 pins
- Support for QFN packages
