Ensigma Connectivity

CRF4600 RFIC IP in TSMC 65nm LP

High-performance and low power connectivity​

The Ensigma high-performance CRF45xx and CRF46xx Wi-Fi RFIC IPs in TSMC 65nm LP provide a highly flexible, dual-band Wi-Fi solution capable of supporting up to IEEE 802.11n/ac 4×4 MIMO, IEEE 802.11p and Bluetooth 5.0. The IPs provide a compact ultra-small form factor solution with minimal external components to drive the costs for mass volumes and allows for flexibility in size, form, and function.

Features
  • Designed for TSMC 65nm process
  • Internal power amplifiers
  • Designed for QFN packages
  • Dual synthesisers
Benefits
  • Automotive qualification
  • Silicon ready design
  • Lowest power consumption
  • Easy integration with companion baseband chip
Applications
  • Automotive V2X
  • Connected home
  • Digital TV and set-top boxes
Process
  • TSMC 65 nm LP (1P6M, 1.2V/2.5V)
  • 6 metal layers including UTM (ultra-thick metal)
General Features
  • 3/4-wire SPI control interface
  • On-chip LDO regulators
  • On-chip XO for XTAL operation
  • Direct conversion receiver and transmitter
  • RX RSSI function
  • TX TSSI function
  • On-chip baluns for single-ended RF input and output
  • No external trimming required in production except for XO frequency trimming
  • Low output spur and strong receive blocking performance
  • Support for power compensation of external PA to produce stable transmit power across temperature
  • Fast AGC and wide dynamic range allow for excellent robustness against fading
  • Fully integrated fractional-N synthesizer
  • Low phase noise and fast switching time
  • Support for antenna diversity
Package
  • Package: QFN with 56 pins
Key Characteristics
  • 2.4 GHz and 5 GHz operation
  • Integrated power amplifiers
  • +15 dBm maximum output power in 5 GHz
  • +17 dBm maximum output power in 2.4 GHz
  • Support for digital pre-distortion
  • 22 dB gain range in transmit mode
  • TX EVM < -32 dB internal power amplifier mode
  • Supported for 40 and 52 MHz reference clocks
  • Support for 10 MHz in 802.11p configuration
  • Fast Channel Switching (< 200 µs)
  • Fast wake up from standby, typically 20 µs
  • Die area: 8.2 mm2
  • Die dimensions: 2176 um x 3776 um