IMG CRF4510

Ensigma RF Family

Ultra-efficient, high performance connectivity

The high-performance IMG CRF45xx series Wi-Fi RFIC IPs is available in TSMC 65nm LP. It provides a highly flexible, dual-band Wi-Fi solution capable of supporting up to IEEE 802.11n/ac 4×4 MIMO, IEEE 802.11p and Bluetooth 5.1.

Features
  • Dual-band (2.4/5 GHz) Tx and Rx
  • Supports Single Stream and 2×2 MIMO Wi-Fi
  • Designed for TSMC 65nm LP CMOS process
  • Internal power amplifiers
  • Frequency trimmable on-chip reference oscillator enables the use of low-cost crystals
  • Analogue IQ-interface
  • Designed for QFN packages
Benefits
  • Silicon ready design
  • Complete low-power Wi-Fi RF solution
  • Low power consumption
  • Easy integration with baseband SoCs
Applications
  • Digital TV and set-top boxes
  • Tablets
  • Connected consumer products
  • Internet of Things
General Features
  • 3/4-wire SPI control interface
  • On-chip LDO regulators
  • On-chip XO for XTAL operation, with digital buffered output
  • Supports:
    • 20, 40, and 80 MHz Wi-Fi channels
    • 1, 2, 3 Mbps Bluetooth channels
    • 1, 2 Mbps Bluetooth LE channels
  • Direct conversion receiver and transmitter
  • Rx RSSI function
  • Tx TSSI function
  • On-chip baluns for single-ended RF input and output
  • No external trimming required in production except for XO frequency trimming
  • Low spur output and strong receive blocking performance
  • Support for power compensation of external PA to produce stable transmit power across temperature
  • Fast AGC and wide dynamic range allow for excellent robustness against fading
  • Fully integrated fractional-N synthesiser
  • Low phase noise and fast switching time
Key Characteristics
  • 2.4 GHz and 5 GHz operation
  • Integrated power amplifiers:
    • +16 dBm maximum output power in 5 GHz
    • +18 dBm maximum output power in 2.4 GHz
  • Support for digital pre-distortion
  • 22 dB gain range in transmit mode
  • Tx EVM < -35 dB with external power amplifier
  • Tx EVM < -32 dB with internal power amplifiers
  • Support for 40 MHz or 52 MHz reference clock
  • Fast wake up from standby, typically 20 µs
  • Die dimensions: 1856 µm x 4864 µm (9.0 mm2)
Process
  • TSMC 65nm LP (1.2V/2.5V)
  • 6 metal layers including UTM (ultra-thick metal)
Package
  • Rt-MLF with 96 pins
  • Support for QFN packages with no external matching