Ensigma RF Family

High-performance and low power connectivity​

An ultra-small form factor automotive grade solution with minimal external components and allows for flexibility in size, form and function. The IMG CRF4600 Wi-Fi RFIC IP is designed with automotive V2X applications in mind.

  • Dual-band (2.4/5 GHz) Tx and Rx
  • Support for IEEE 802.11p
  • Supports Single Stream and 2×2 MIMO Wi-Fi
  • Designed for TSMC 65nm LP CMOS process
  • Internal power amplifiers
  • Frequency trimmable on-chip reference oscillator enables the use of low-cost crystals
  • Digital IQ interface
  • Designed for QFN packages
  • Dual synthesisers
  • Silicon proven design
  • Automotive qualification
  • Lowest power consumption
  • Easy integration with baseband SoCs
  • Automotive V2X
  • Connected consumer products
  • Internet of Things
  • Intelligent Transportation Systems
General Features
  • 3/4-wire SPI control interface
  • On-chip LDO regulators
  • On-chip XO for XTAL operation, with digital buffered output
  • Supports 10, 20, 40, and 80 MHz channels
  • Direct conversion receiver and transmitter
  • Rx RSSI function
  • Tx TSSI function
  • On-chip baluns for single-ended RF input and output
  • No external trimming required in production except for XO frequency trimming
  • Low spur output and strong receive blocking performance
  • Support for power compensation of external PA to produce stable transmit power across temperature
  • Fast AGC and wide dynamic range allow for excellent robustness against fading
  • Fully integrated fractional-N synthesiser
  • Low phase noise and fast switching time
  • Support for antenna diversity
Key Characteristics
  • 2.4 GHz and 5 GHz operation
  • Integrated Power Amplifiers:
    • +15 dBm maximum output power in 5 GHz
    • +17 dBm maximum output power in 2.4 GHz
  • Support for digital pre-distortion
  • 22 dB gain range in transmit mode
  • Tx EVM < -32 dB with internal power amplifiers
  • Support for 40 MHz or 52 MHz reference clock
  • Fast Channel Switching (< 200 µs)
  • Fast wake up from standby, typically 20 µs
  • Support for 10 MHz bandwidth in 802.11p configuration
  • Die dimensions: 2176 µm x 3776 µm (8.2 mm2)
  • TSMC 65 nm LP (1.2V/2.5V)
  • 6 metal layers including UTM (Ultra-Thick Metal)
  • QFN with 56 pins