A silicon-proven Wi-Fi RF solution, reducing time-to-market.
Designed to reduce risk and improve time to market
The iE1000 is available to licence as wafers from the foundry, ready to be packaged by the customer.
Production silicon minimises risk and reduces the time-to-market. A complete low-power Wi-Fi RF solution with industry-leading performance.
Flexibility meets functionality for small form factor designs
A dual-band (2.4/5 GHz) Wi-Fi RFIC solution capable of supporting up to IEEE 802.11 n/ac 2 x 2 MIMO. Enables compact, ultra-small form factor solutions, with minimal external components, reducing both silicon and system-level eBOM costs.
The iE1000 is designed to meet the low-power consumption requirements of communication devices such as IoT and wearables. By utilising advanced design techniques, the lowest active and idle power is delivered to extend the system battery life. This coupled with strong RF performance ensures consistent connectivity and enables robust system-level performance.
TSMC 65nm LPS CMOS process.
By delivering the lowest active and idle power, IMG iE1000 enables longer battery life while maintaining consistent and robust connectivity.
iE1000 is an excellent companion chip to the Ensigma high-performance Wi-Fi baseband IP.