IMG iE1000

A silicon-proven Wi-Fi RF solution, reducing time-to-market.

Designed to reduce risk and improve time to market

The iE1000 is available to licence as wafers from the foundry, ready to be packaged by the customer.

Production silicon minimises risk and reduces the time-to-market. A complete low-power Wi-Fi RF solution with industry-leading performance.

Flexibility meets functionality for small form factor designs

A dual-band (2.4/5 GHz) Wi-Fi RFIC solution capable of supporting up to IEEE 802.11 n/ac 2 x 2 MIMO. Enables compact, ultra-small form factor solutions, with minimal external components, reducing both silicon and system-level eBOM costs.

Low-power markets

The iE1000 is designed to meet the low-power consumption requirements of communication devices such as IoT and wearables. By utilising advanced design techniques, the lowest active and idle power is delivered to extend the system battery life. This coupled with strong RF performance ensures consistent connectivity and enables robust system-level performance.

architectural efficience

Proven design

TSMC 65nm LPS CMOS process.

RF

Consistent connectivity

By delivering the lowest active and idle power, IMG iE1000 enables longer battery life while maintaining consistent and robust connectivity.

Flexiabledesign

Ensigma compatibility

iE1000 is an excellent companion chip to the Ensigma high-performance Wi-Fi baseband IP.

IMG iE1000
HIGH-PERFORMANCE AND LOW-POWER CONNECTIVITY

Download the IMG iE1000 product brief to find out more.

Sharpen your competitive edge with IMG iE1000