IMG iE1000

Ensigma RF Family

High-performance and low power connectivity

The IMG iE1000 is a dual-band Wi-Fi RFIC solution capable of supporting up to IEEE 802.11n/ac 2×2 MIMO.  The IMG iE1000 is available to licence as wafers from the foundry and only needs packaging by the customer. IMG iE1000 is an excellent companion chip to the IMG iEW300 Wi-Fi baseband IP.

  • Dual-band (2.4/5 GHz) Tx and Rx
  • Supports Single Stream and 2×2 MIMO Wi-Fi
  • Designed for TSMC 65nm LPS CMOS process
  • Flexible RF interfaces
  • Industry-leading performance
  • Production silicon minimises risk, and reduces time-to-market
  • Low power consumption
  • Complete low-power Wi-Fi RF solution
  • Digital TV and set-top boxes
  • Tablets
  • Connected consumer products
  • Internet of Things
General Features
  • 3/4-wire SPI control interface
  • On-chip LDO regulators
  • On-chip XO for XTAL operation, with analogue and digital buffered outputs
  • Supports 20, 40, and 80 MHz channels
  • Direct conversion receiver and transmitter
  • Rx RSSI function
  • Tx TSSI function
  • On-chip baluns for single-ended RF input and output
  • No external trimming required in production except for XO frequency trimming
  • Low spur output and strong receive blocking performance
  • Support for power compensation of external PA to produce stable transmit power across temperature
  • Fast AGC and wide dynamic range allow for excellent robustness against fading
  • Fully integrated fractional-N synthesizer
  • Low phase noise and fast switching time
  • Support for antenna diversity selection
Key Characteristics
  • 2.4 GHz and 5 GHz operation
  • 22 dB gain range in transmit mode
  • Rx EVM floor < -32 dB
  • Support for 40 MHz and 52 MHz reference clock 
  • Fast channel switching, typically 10 µs
  • Fast wake up from standby, typically 20 µs
  • Die dimensions: 1856 µm x 3712 µm (6.9 mm2)
  • TSMC 65 nm LP (1.2V/2.5V)
  • 6 metal layers including UTM (ultra-thick metal)
  • aQFN 84 dual row (7.0 x 7.0 x 0.85 mm)