iEW 200 Series

Ensigma Wi-Fi Connectivity Family

IEEE 802.11n Wi-Fi

The Ensigma IEEE 802.11n Wi-Fi consists of end-to-end solution including RF, AFE, baseband PHY and MAC. The RF IP is offered in the 40LP TSMC CMOS process. Utilising advanced design techniques and process technology to deliver ultra-low active and idle power, the macro extends the system battery life while maintaining consistent connectivity and providing a rich set of features.

2.4/5 GHz 40 MHz TSMC40

Features
  • Designed for TSMC 40nm LP CMOS
  • Internal Power Amplifiers
  • Sleep Controller to ensure overall system-level power consumption reduction
  • Design for QFN packages
Benefits
  • Complete low-power Wi-Fi solution
  • Silicon-ready design
  • Ultra-low-power
  • Easy integration into an SoC
Applications
  • Internet of Things
  • Connected consumer products
  • Industrial automation
  • Wearables
RF Features
  • Complete 2.4 and 5 GHz RF including PA
  • Power-efficient AGC
  • Optimised PLL power consumption
  • Customised PA to minimise Tx power consumption
  • Power optimised DAC/ADC design
  • Integrated transmit/receive switch for RF
  • Single-pin RF antenna interface
IEEE 802.11 PHY Support (2.4/5 GHz)
  • IEEE 802.11b DSSS/CCK (up to 11 Mbps)
  • IEEE 802.11a/g OFDM (up to 54 Mbps)
  • IEEE 802.11n OFDM
  • MCS 0-7, (20/40 MHz channels, up to 72.2/150 Mbps)
Software
  • Lower MAC runs inside the RPU
  • Optional ROM-based UMAC executing on a dedicated processor
  • Patch RAM facility for LMAC and UMAC firmware upgrade
  • Linux host reference driver
  • HW/SW partition optimised to minimise power consumption
Power Management (Optional)
  • Power Management System comprising of:
    • DC-DC converters
    • LDO regulators
    • Supports an external 32 kHz XTAL interface
  • Sleep Controller
    • Always-On Block (AON) – Logic for 32 KHz design
  • Multiple Power Domains
Process
  • TSMC 40nm LP (1P8M, 1.1V/2.5V)
  • 1p7m_4x1z1u_utalrdl metal stack
  • Required process options:
  • DNW (Deep N-Well)
  • MOM (requires no extra mask)
  • SVT and HVT
Package
  • Support for QFN packages – no requirement for external matching
  • Other packages are supported but may require custom external matching

2.4 GHz 20 MHz TSMC40

Features
  • Designed for TSMC 40nm LP CMOS
  • Internal Power Amplifiers
  • Sleep Controller to ensure overall system-level power consumption reduction
  • Design for QFN packages
Benefits
  • Complete low-power Wi-Fi solution
  • Silicon-proven design
  • Ultra-low-power
  • Easy integration into an SoC
Applications
  • Internet of Things
  • Connected consumer products
  • Industrial automation
RF Features
  • Power-efficient AGC
  • Optimised PLL power consumption
  • Customised PA to minimize Tx power consumption
  • Power optimised DAC/ADC design
  • Integrated transmit/receive switch for RF
  • Single-pin RF antenna interface
IEEE 802.11 PHY Support (2.4 GHz)
  • IEEE 802.11b DSSS/CCK (up to 11 Mbps)
  • IEEE 802.11g OFDM (up to 54 Mbps)
  • IEEE 802.11n OFDM
  • MCS 0-7, (72.2 Mbps)
Software
  • Lower MAC runs inside the RPU
  • The Upper MAC including the supplicant, TCP/IP etc. runs on Linux Host CPU
  • HW/SW partition optimised to minimize power consumption
Power Management
  • Power Management System comprising of:
    • DC-DC converters (External)
    • LDO regulators
    • 32 kHz Real Time Clock (External XTAL)
  • Sleep Controller
    • Always-On Block (AON) – Logic for 32 KHz design
  • Multiple Power Domains
Process
  • TSMC 40nm LP (1P8M, 1.1V/2.5V)
  • 1P8M_5X0Y2Z0R0U_ALRDLmetal stack
  • Required process options:
    DNW (Deep N-Well)
    MOM (requires no extra mask)
    SVT and HVT
Package
  • Support for QFN packages – no requirement for external matching
  • Other packages are supported but may require custom