Ensigma Connectivity iE1000 RFIC IP in TSMC 65nm LP

Filesize 257 KB
Version 1
Date added Nov 8, 2018
Category Documentation
Tags Ensigma, IEEE 802.11ac, Wi-Fi

Ensigma™ Connectivity is a family of high-performance and low power IP solutions for wireless standards such as Wi-Fi, Bluetooth, Bluetooth Low Energy (BLE) and IEEE 802.15.4 based solutions such as Zigbee and Thread. The IP is specifically designed to meet the communications requirements for the low-power consumption markets such as the Internet of Things (IoT) and wearables. Ensigma Connectivity solutions implement all of the communication requirements for complex low-power System on Chips (SoCs).

The Ensigma high-performance Wi-Fi and Bluetooth RFIC IPs in TSMC 65nm LP provide a highly flexible, dual-band Wi-Fi solution capable of supporting up to IEEE 802.11n/ac 4×4 MIMO, IEEE 802.11p and Bluetooth 5.0. The IPs provide a compact ultra-small form factor solution with minimal external components to drive the costs for mass volumes and allows for flexibility in size, form, and function.

The Ensigma iE1000 Wi-Fi RFIC IP supports dual-band IEEE 802.11n/ac 2×2 and is an excellent companion chip to the Ensigma high-performance Wi-Fi baseband IP.